Take Sn/Cu as basis jointing a trace of Ni and P becoming lead-free Sn/Cu/Ni alloy to improve solder’s wettability and liquidity. It is able to reduce IMC formation rate and has marvelous solder joint performance in wave soldering and HASL process than Sn/37Pb alloy. Meanwhile its solder joint performance in lead-free wave soldering is smoother and brighter than high silver content alloy such as SAC305.
NAP100 Microstructure Analysis
NAP100 Reliability Test (2)- PCBA Microstructure Analysis
NAP100 Reliability Test (3)- PCBA Tin whisker Analysis
NAP100- Process Parameter & Pilot Run Test
– Wave Soldering Application Alloy
Less 20% Dross Formation Than Other Brand Solder Bar
Keep 7-8 Hours Mirror Surface on Solder Pot
| High Silver Content | • Sn/3.0Ag/0.5Cu | SAC305 (E9650) |
|---|---|---|
| • Sn/3.0Ag | SAC305CX (9650CX) | |
| Low Silver Content | • Sn/0.3Ag/0.7Cu | SAC0307 |
| • Sn/0.3Ag | 0307CX | |
| No Silver Content | • Sn/0.7Cu/Ni | NAP100 |
| • Sn/Ni | NAP100CX |
– Alloy Properties
| Alloy System | SAC305 | NAP100 | SAC0307 |
|---|---|---|---|
| Physical Properties | |||
| M/P | 217-218℃ | 227℃ | 217-227℃ |
| Density | 7.4 | 7.3 | 7.3 |
| Elongation(%) | 50 | 41.2 | 49 |
| Electrical & Thermal Properties | |||
| Specific Heat | 219 | 219 | 170 |
| Thermal Conductivity (W/M-K) | 57.15 | 57 | 57.36 |
| Electrical Resistivity (µΩ-cm) | 12.1 | 10.15 | 12.1 |
| Thermal Fatigue Properties | |||
| 200 cycles / 400hrs (-40℃/+125℃) | Pass | Pass | Pass |
| 840 cycles / 400hrs (-40℃/+85℃) | Pass | Pass | Pass |
| 1000-1500 cycles / 400hrs (-40℃/+125℃) | Pass | Pass | Pass |
| Soldering Properties | |||
| Solder Joint | Less shine Sn/Cu | Shine | Less shine Sn/Cu |
| Wetting Time (sec) at 260 ℃ | 0.45 | 0.814 | 1.10 |
■ MB Solder Bar & Solder Ball
– Specialized in high working temp. (350-500℃)soldering alloy
Strong Anti-Oxidation ability on high work temp.
Less 20% dross formation rate than conventional solder bar
Keep 1-1.5 Hours mirror surface on solder pot under 500℃
| High Silver Content | •Sn/3.0Ag/0.5Cu | MB-SAC305 (E9650) |
|---|---|---|
| Low Silver Content | •Sn/0.3Ag/0.7Cu | MB-SAC0307 |
| No Silver Content | •Sn/Cu/Ni | MB-NAP100 * R.O.C. Patent No. I 366495), Ni-Modified Sn/Cu SnCu0.7Ni0.05AlxPy |
| •Sn/0.7Cu | MB-D9930C |
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