Application
Suitable for SMD(BGA, QFP etc.) Repair, Support IC Chips Min Size. 2mm * 2mm.
Please note: Specification are subject to change without notice!
Technical Parameters
Power Supply: | AC 380V±10% 50/60 Hz |
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Total Power: | Max 9200W |
Power of Top Hot Air Heater: | 1000 W |
Power of Bottom Hot Air Heater: | 1200 W |
Power of IR pre-heater: | 6600 W |
Temperature Error: | ±1℃ |
Placement Accuracy: | ±0.01mm |
Placement Pressure: | <0.2N |
Hot Air Heating Temperature: | 400℃(Max) |
PCB Size: | 640mm×520mm |
BGA Chip Size | 2×2mm–80×80mm |
Control system | Industrial PC+Servo Motion control |
Dimension: | L1020×W840×H1620mm |
Sensor: | 5 |
Net Weight: | About 230kg |
Color: | White/Red |
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