For Electronic Device and Semiconductor packaging
| • Low Voiding rate
(average voiding rate below 15%) |
DWQ401 | |
|---|---|---|
| DWQ401UF (IC bump forming) |
||
| DWQ401PK (IC bump forming) |
||
| • Ultra – Fine Pitch
(available T6, T7, micro assembly solution) |
PN451 (IC flip chip bonding) |
|
| • Water Soluble
(Environmental stability with excellent print characteristics) |
XT931 | |
| XT931PK | ||
| • Zero Halogen
(High reliability guaranteed) |
QT459DE | |
| QT459DEUF
(IC application) |
||
| • Fine Pitch
(High throughput SMT process solution) |
PN436 | |
| • For Low Temp. alloy
(Applicable Sn/Bi, Sn/Bi/Ag lead – free alloy) |
DWQ631 | |
| XT963 | ||
| • For Tin-Lead alloy
(Applicable Sn/Pb, Sn/Pb/Ag alloy) |
AM218FT | |
| • HEAT SINK | HSXT996 |
QT459DE is a No-clean & Halogen-free paste flux specifically designed for optimal characteristics in virtually any SMT application.
Provides consistent stencil release and repeatable print volumes for fine-pitch applications.
QT459DE offers high humidity tolerance and a chemistry developed for use in air reflow.
The results of the reliability tests indicate that solder paste meets the requirements of IPC J-STD-004.
In the process of SMT printing, the stencil needs cleaning every 4 or 5 prints. With usage of PN436 lead free solder paste, the cleaning frequency is substantially lowered, saving lots of time and costs of stencil cleaning, which in turn helps improve productivity.
PN436 lead free solder paste carries out perfect printing performance with excellent deposition, stable viscosity after continuous printing for 8 hours and full and complete printing shape without clogging.
Reviews
There are no reviews yet.