SPECIFICATIONS
| Model name | S10 | S20 | |
| Board | With buffer unused | Min. L50 x W30mm to | Min. L50 x W30mm to |
| Size | Max. L980 x W510mm | Max. L1,480 x W510mm | |
| With input or output | Min. L50 x W30mm to | — | |
| buffers used | Max. L420 x W510mm | ||
| With input and output | Min. L50 x W30mm to | Min. L50 x W30mm to | |
| buffers used | Max. L330 x W510mm | Max. L540 x W510mm | |
| With input and output buffers used | 0.4 – 5.0mm | ||
| Placement accuracy A (μ+3σ) | CHIP ± 0.040mm | ||
| Placement accuracy B (μ+3σ) | IC ± 0.025mm | ||
| Placement angle | ± 180° | ||
| Component height | 6-axis 6-theta head: Max. 35mm | ||
| (Board thickness + component height) | 12-axis 2-theta head: Max. 20mm | ||
| Applicable Components | 0201-120mm x 90mm, BGA, CSP,Connectors, | ||
| other odd-shaped components | |||
| Component package | 8-56mm tape (F1/F2 Feeders), | ||
| 8-88mm tape (F3 Electric Feeders), | |||
| Stick, Tray | |||
| Component types | Max. 90 types | Max. 180 types | |
| (8mm tape conversion) | (8mm tape), 45 lanes x 2 | (8mm tape), 45 lanes x 4 | |
| Transfer height | 900 ± 20mm | ||
| Machine Dimensions | L1,250 x D1,770 x | L1,750 x D1,770 x | |
| H1,420mm | H1,420mm | ||
| Weight | Approx. 1,200kg | Approx. 1,500kg | |
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