High Speed Glue Machine(GDK-D3)

High Speed Glue Machine(GDK-D3)

Code: N/A

Call to us

Application Range:

Encapsulation protection of PCB board and FPC soft board parts,
reinforcement of camera module, fingerprint recognition module
dispensing IC chip , Component underfill and component
encapsulation shell frame dispensing
red phosphor, dam, precition coating, etc

Delivery time 3 weeks

Hotline: +84 769 116 968 sales@smt-vn.com

Chia sẻ