High Speed Glue Machine(GDK-D3)
High Speed Glue Machine(GDK-D3)
Code: N/A
Call to us
Application Range:
Encapsulation protection of PCB board and FPC soft board parts,
reinforcement of camera module, fingerprint recognition module
dispensing IC chip , Component underfill and component
encapsulation shell frame dispensing
red phosphor, dam, precition coating, etc
Delivery time 3 weeks
Hotline: +84 769 116 968 sales@smt-vn.com
Amount
Reviews
There are no reviews yet.