High Speed Glue Machine(GDK-D3)

High Speed Glue Machine(GDK-D3)

Code: N/A

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Application Range:

Encapsulation protection of PCB board and FPC soft board parts,
reinforcement of camera module, fingerprint recognition module
dispensing IC chip , Component underfill and component
encapsulation shell frame dispensing
red phosphor, dam, precition coating, etc

Delivery time 3 weeks

Hotline: +84 988 919 818 Email: cuong@smt-vn.com

+84 769 116 968 sales@smt-vn.com

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